20

Suspended integration of pyrolytic carbon membrane on C-MEMS

Year:
2015
Language:
english
File:
PDF, 976 KB
english, 2015
21

Defect detection of flip-chip solder joints using modal analysis

Year:
2012
Language:
english
File:
PDF, 1.97 MB
english, 2012
24

Genetic algorithms for defect detection of flip chips

Year:
2015
Language:
english
File:
PDF, 1.95 MB
english, 2015
28

Dynamics of Contact Wave in Silicon Wafer Direct Bonding

Year:
2010
Language:
english
File:
PDF, 673 KB
english, 2010
40

Flip chip solder bump inspection using vibration analysis

Year:
2012
Language:
english
File:
PDF, 689 KB
english, 2012
41

Using active thermography for defects inspection of flip chip

Year:
2014
Language:
english
File:
PDF, 3.60 MB
english, 2014